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Damena Agonafer
Damena Agonafer
Adresse e-mail validée de umd.edu
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Fundamental cooling limits for high power density gallium nitride electronics
Y Won, J Cho, D Agonafer, M Asheghi, KE Goodson
IEEE transactions on components, Packaging and Manufacturing Technology 5 (6 …, 2015
1422015
Extreme two‐phase cooling from laser‐etched diamond and conformal, template‐fabricated microporous copper
JW Palko, H Lee, C Zhang, TJ Dusseault, T Maitra, Y Won, DD Agonafer, ...
Advanced Functional Materials 27 (45), 1703265, 2017
992017
Cooling limits for GaN HEMT technology
Y Won, J Cho, D Agonafer, M Asheghi, KE Goodson
2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS), 1-5, 2013
902013
Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices
H Lee, DD Agonafer, Y Won, F Houshmand, C Gorle, M Asheghi, ...
Journal of Electronic Packaging 138 (1), 010907, 2016
772016
Low Reynolds number flow across an array of cylindrical microposts in a microchannel and figure-of-merit analysis of micropost-filled microreactors
J Yeom, DD Agonafer, JH Han, MA Shannon
Journal of Micromechanics and Microengineering 19 (6), 065025, 2009
592009
Microscale evaporative cooling technologies for high heat flux microelectronics devices: Background and recent advances
MM Nahar, B Ma, K Guye, QH Chau, J Padilla, M Iyengar, D Agonafer
Applied Thermal Engineering 194, 117109, 2021
512021
High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply
JW Palko, H Lee, DD Agonafer, C Zhang, KW Jung, J Moss, JD Wilbur, ...
2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016
422016
A holistic approach to thermal-hydraulic design of 3D manifold microchannel heat sinks for energy-efficient cooling
D Kong, Y Kim, M Kang, E Song, Y Hong, HS Kim, KJ Rah, HG Choi, ...
Case Studies in Thermal Engineering 28, 101583, 2021
342021
Investigation of the confinement effect on the evaporation behavior of a droplet pinned on a micropillar structure
J Li, L Shan, B Ma, X Jiang, A Solomon, M Iyengar, J Padilla, D Agonafer
Journal of colloid and interface science 555, 583-594, 2019
292019
Inverse opals for fluid delivery in electronics cooling systems
TJ Dusseault, J Gires, MT Barako, Y Won, DD Agonafer, M Asheghi, ...
Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2014
272014
Investigation of the evaporation heat transfer mechanism of a non-axisymmetric droplet confined on a heated micropillar structure
L Shan, B Ma, J Li, B Dogruoz, D Agonafer
International journal of heat and mass transfer 141, 191-203, 2019
262019
Porous micropillar structures for retaining low surface tension liquids
DD Agonafer, H Lee, PA Vasquez, Y Won, KW Jung, S Lingamneni, B Ma, ...
Journal of colloid and interface science 514, 316-327, 2018
262018
Study of insulating properties of alkanethiol self-assembled monolayers formed under prolonged incubation using electrochemical impedance spectroscopy
DD Agonafer, E Chainani, ME Oruc, KS Lee, MA Shannon
Journal of Nanotechnology in Engineering and Medicine 3 (3), 031006, 2012
232012
Molecular dynamics simulations of thin-film evaporation: The influence of interfacial thermal resistance on a graphene-coated heated silicon substrate
B Ma, K Guye, B Dogruoz, D Agonafer
Applied Thermal Engineering 195, 117142, 2021
222021
Evolution of microdroplet morphology confined on asymmetric micropillar structures
B Ma, L Shan, B Dogruoz, D Agonafer
Langmuir 35 (37), 12264-12275, 2019
222019
Influence of boundary conditions on sub-millimeter combustion
S Prakash, R Akberov, D Agonafer, AD Armijo, MA Shannon
Energy & fuels 23 (7), 3549-3557, 2009
212009
Experimental investigation of evaporation from asymmetric microdroplets confined on heated micropillar structures
L Shan, J Li, B Ma, X Jiang, B Dogruoz, D Agonafer
Experimental Thermal and Fluid Science 109, 109889, 2019
202019
Materials and interface challenges in high-vapor-quality two-phase flow boiling research
D Agonafer, MS Spector, N Miljkovic
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021
192021
Burst behavior at a capillary tip: Effect of low and high surface tension
DD Agonafer, K Lopez, JW Palko, Y Won, JG Santiago, KE Goodson
Journal of colloid and interface science 455, 1-5, 2015
192015
An additively manufactured manifold-microchannel heat sink for high-heat flux cooling
D Kong, E Jung, Y Kim, VV Manepalli, KJ Rah, HS Kim, Y Hong, HG Choi, ...
International Journal of Mechanical Sciences 248, 108228, 2023
152023
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