Yann Beilliard
Yann Beilliard
PhD, Adjunct Professor, Université de Sherbrooke
Adresse e-mail validée de usherbrooke.ca
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Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding
Y Beilliard, S Moreau, L Di Cioccio, P Coudrain, G Romano, ...
2014 International 3D Systems Integration Conference (3DIC), 1-8, 2014
Chip to wafer copper direct bonding electrical characterization and thermal cycling
Y Beilliard, P Coudrain, L Di Cioccio, S Moreau, L Sanchez, ...
2013 IEEE International 3D Systems Integration Conference (3DIC), 1-7, 2013
In‐Memory Vector‐Matrix Multiplication in Monolithic Complementary Metal–Oxide–Semiconductor‐Memristor Integrated Circuits: Design Choices, Challenges, and Perspectives
A Amirsoleimani, F Alibart, V Yon, J Xu, MR Pazhouhandeh, S Ecoffey, ...
Advanced Intelligent Systems 2 (11), 2000115, 2020
Thermomechanical finite element modeling of Cu–SiO2 direct hybrid bonding with a dishing effect on Cu surfaces
Y Beilliard, R Estevez, G Parry, P McGarry, L Di Cioccio, P Coudrain
International Journal of Solids and Structures 117, 208-220, 2017
Cu–SiO2 Hybrid Bonding
L Di Cioccio, S Moreau, L Sanchez, F Baudin, P Gueguen, S Mermoz, ...
Handbook of 3D Integration, 295-312, 2014
Mass transport-induced failure in direct copper (Cu) bonding interconnects for 3-D integration
S Moreau, Y Beilliard, P Coudrain, D Bouchu, R Taibi, L Di Cioccio
2014 IEEE International Reliability Physics Symposium, 3E. 2.1-3E. 2.6, 2014
Investigation of resistive switching and transport mechanisms of Al2O3/TiO2−x memristors under cryogenic conditions (1.5 K)
Y Beilliard, F Paquette, F Brousseau, S Ecoffey, F Alibart, D Drouin
AIP Advances 10 (2), 025305, 2020
Next generation image sensor via direct hybrid bonding
L Benaissa, L Di Cioccio, Y Beilliard, P Coudrain, S Dominguez, V Balan, ...
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-3, 2015
Process for direct bonding of two elements comprising metallic portions and dielectric materials
L Di Cioccio, Y Beilliard
US Patent App. 14/504,701, 2015
ExaNoDe: combined integration of chiplets on active interposer with bare dice in a multi-chip-module for heterogeneous and scalable high performance compute nodes
PY Martinez, Y Beilliard, M Godard, D Danovitch, D Drouin, J Charbonnier, ...
2020 IEEE Symposium on VLSI Technology, 1-2, 2020
Fabrication of Planar Back End of Line Compatible HfO Complementary Resistive Switches
M Labalette, S Jeannot, S Blonkowski, Y Beilliard, S Ecoffey, A Souifi, ...
IEEE Transactions on Nanotechnology 16 (5), 745-751, 2017
Towards alternative technologies for fine pitch interconnects
SC JP Colonna, R Segaud, F Marion, M Volpert, A Garnier, L Di Cioccio, Y ...
Electronic Components and Technology Conference (ECTC), 2013
Etude de l'intégration du collage direct cuivre/oxyde pour l'élaboration d'une architecture 3D-SIC
Y Beilliard
Université Grenoble Alpes (ComUE), 2015
Fabrication of 2D and 3D inductors for DC-DC converters integrated on glass interposer
V Lafage, Y Beilliard, A Sridhar, T Brunschwiler, D Drouin
2018 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-8, 2018
Device comprising a three-dimensional integrated structure with simplified thermal dissipation, and corresponding fabrication method
S Lhostis, O Kokshagina, Y Beilliard, V Fiori
US Patent 9,449,896, 2016
Electromigration in hybrid bonding interconnects for 3-D IC impact of the diffusion barrier
S Moreau, Y Beilliard, P Coudrain, D Bouchu, L Di Cioccio, L Arnaud
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-6, 2015
Oxygen vacancy engineering of TaO x-based resistive memories by Zr doping for improved variability and synaptic behavior
JHQ Palhares, Y Beilliard, F Alibart, E Bonturim, DZ de Florio, FC Fonseca, ...
Nanotechnology 32 (40), 405202, 2021
Fully CMOS-compatible passive TiO2-based memristor crossbars for in-memory computing
AE Mesoudy, G Lamri, R Dawant, J Arias-Zapata, P Gliech, Y Beilliard, ...
arXiv preprint arXiv:2106.11808, 2021
Signals to Spikes for Neuromorphic Regulated Reservoir Computing and EMG Hand Gesture Recognition
N Garg, I Balafrej, Y Beilliard, D Drouin, F Alibart, J Rouat
arXiv preprint arXiv:2106.11169, 2021
Miniaturizing neural networks for charge state autotuning in quantum dots
S Czischek, V Yon, MA Genest, MA Roux, S Rochette, JC Lemyre, ...
arXiv preprint arXiv:2101.03181, 2021
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