Yann Beilliard
Yann Beilliard
Researcher at CEA-Leti - Adjunct Professor, Université de Sherbrooke
Verified email at
Cited by
Cited by
In‐Memory Vector‐Matrix Multiplication in Monolithic Complementary Metal–Oxide–Semiconductor‐Memristor Integrated Circuits: Design Choices, Challenges, and Perspectives
A Amirsoleimani, F Alibart, V Yon, J Xu, MR Pazhouhandeh, S Ecoffey, ...
Advanced Intelligent Systems 2 (11), 2000115, 2020
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO2 direct hybrid bonding
Y Beilliard, S Moreau, L Di Cioccio, P Coudrain, G Romano, ...
2014 International 3D Systems Integration Conference (3DIC), 1-8, 2014
Thermomechanical finite element modeling of Cu–SiO2 direct hybrid bonding with a dishing effect on Cu surfaces
Y Beilliard, R Estevez, G Parry, P McGarry, L Di Cioccio, P Coudrain
International Journal of Solids and Structures 117, 208-220, 2017
Cu–SiO2 Hybrid Bonding
L Di Cioccio, S Moreau, L Sanchez, F Baudin, P Gueguen, S Mermoz, ...
Handbook of 3D Integration, 295-312, 2014
Chip to wafer copper direct bonding electrical characterization and thermal cycling
Y Beilliard, P Coudrain, L Di Cioccio, S Moreau, L Sanchez, ...
2013 IEEE International 3D Systems Integration Conference (3DIC), 1-7, 2013
Fully CMOS-compatible passive TiO2-based memristor crossbars for in-memory computing
A El Mesoudy, G Lamri, R Dawant, J Arias-Zapata, P Gliech, Y Beilliard, ...
Microelectronic Engineering 255, 111706, 2022
Method of assembly by direct bonding between two elements, each element comprising portions of metal and dielectric materials
L Di Cioccio, Y Beilliard
US Patent 11,305,372, 2022
Investigation of resistive switching and transport mechanisms of Al2O3/TiO2− x memristors under cryogenic conditions (1.5 K)
Y Beilliard, F Paquette, F Brousseau, S Ecoffey, F Alibart, D Drouin
AIP Advances 10 (2), 2020
Miniaturizing neural networks for charge state autotuning in quantum dots
S Czischek, V Yon, MA Genest, MA Roux, S Rochette, JC Lemyre, ...
Machine Learning: Science and Technology 3 (1), 015001, 2021
Fabrication of Planar Back End of Line Compatible HfO Complementary Resistive Switches
M Labalette, S Jeannot, S Blonkowski, Y Beilliard, S Ecoffey, A Souifi, ...
IEEE Transactions on Nanotechnology 16 (5), 745-751, 2017
Voltage-dependent synaptic plasticity: Unsupervised probabilistic Hebbian plasticity rule based on neurons membrane potential
N Garg, I Balafrej, TC Stewart, JM Portal, M Bocquet, D Querlioz, D Drouin, ...
Frontiers in Neuroscience 16, 983950, 2022
Signals to spikes for neuromorphic regulated reservoir computing and EMG hand gesture recognition
N Garg, I Balafrej, Y Beilliard, D Drouin, F Alibart, J Rouat
International conference on neuromorphic systems 2021, 1-8, 2021
Oxygen vacancy engineering of TaO x-based resistive memories by Zr doping for improved variability and synaptic behavior
JHQ Palhares, Y Beilliard, F Alibart, E Bonturim, DZ de Florio, FC Fonseca, ...
Nanotechnology 32 (40), 405202, 2021
Conductive filament evolution dynamics revealed by cryogenic (1.5 K) multilevel switching of CMOS-compatible Al2O3/TiO2 resistive memories
Y Beilliard, F Paquette, F Brousseau, S Ecoffey, F Alibart, D Drouin
Nanotechnology 31 (44), 445205, 2020
Next generation image sensor via direct hybrid bonding
L Benaissa, L Di Cioccio, Y Beilliard, P Coudrain, S Dominguez, V Balan, ...
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-3, 2015
Exploiting non-idealities of resistive switching memories for efficient machine learning
V Yon, A Amirsoleimani, F Alibart, RG Melko, D Drouin, Y Beilliard
Frontiers in Electronics 3, 825077, 2022
Codex: Stochastic encoding method to relax resistive crossbar accelerator design requirements
T Liu, A Amirsoleimani, J Xu, F Alibart, Y Beilliard, S Ecoffey, D Drouin, ...
IEEE Transactions on Circuits and Systems II: Express Briefs 69 (8), 3356-3360, 2022
Exanode: combined integration of chiplets on active interposer with bare dice in a multi-chip-module for heterogeneous and scalable high performance compute nodes
PY Martinez, Y Beilliard, M Godard, D Danovitch, D Drouin, J Charbonnier, ...
2020 IEEE Symposium on VLSI Technology, 1-2, 2020
Mass transport-induced failure in direct copper (Cu) bonding interconnects for 3-D integration
S Moreau, Y Beilliard, P Coudrain, D Bouchu, R Taibi, L Di Cioccio
2014 IEEE International Reliability Physics Symposium, 3E. 2.1-3E. 2.6, 2014
Etude de l'intégration du collage direct cuivre/oxyde pour l'élaboration d'une architecture 3D-SIC
Y Beilliard
Université Grenoble Alpes, 2015
The system can't perform the operation now. Try again later.
Articles 1–20