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Coauteurs
James C. HoneDepartment of Mechanical Engineering, Columbia UniversityAdresse e-mail validée de columbia.edu
Paul McEuenProfessor of Physics, Cornell UniversityAdresse e-mail validée de cornell.edu
Pinshane Y. HuangAssociate Professor of Materials Science, University of IllinoisAdresse e-mail validée de illinois.edu
Tony F HeinzDepts. of Applied Physics, Photon Science, and, by courtesy, of Electrical Eng., SLAC, StanfordAdresse e-mail validée de stanford.edu
Gwan-Hyoung LeeProfessor, Materials Science and Engineering, Seoul National UniversityAdresse e-mail validée de snu.ac.kr
David A MullerProfessor of Applied and Engineering Physics, Cornell UniversityAdresse e-mail validée de cornell.edu
Nicholas PetroneDepartment of Mechanical Engineering, Columbia UniversityAdresse e-mail validée de columbia.edu
Scott S VerbridgeAssociate Professor, Virginia Tech - Wake Forest School of Biomedical Engineering and SciencesAdresse e-mail validée de vt.edu
Joshua W. KevekLab Manager/Fault Isolation Engineer, IntelAdresse e-mail validée de cornell.edu
Alexey ChernikovDresden University of Technology (TU Dresden), University of RegensburgAdresse e-mail validée de tu-dresden.de
Carlos S. Ruiz-VargasLumafield.comAdresse e-mail validée de cornell.edu
Robert A. BartonApplied Scientist, AmazonAdresse e-mail validée de cornell.edu
Yilei LiPreviously Department of Physics, Stanford UniversityAdresse e-mail validée de stanford.edu
Ian W. FrankDraper LaboratoryAdresse e-mail validée de draper.com
David TanenbaumProf. Physics Pomona CollegeAdresse e-mail validée de pomona.edu
J. Scott BunchAssociate Professor of Mechanical Engineering, Boston UniversityAdresse e-mail validée de bu.edu
Heather M. HillAssociate Editor, Physics TodayAdresse e-mail validée de aip.org
William S WhitneyCalifornia Institute of TechnologyAdresse e-mail validée de caltech.edu
Albert RigosiNational Institute of Standards and TechnologyAdresse e-mail validée de nist.gov
Jiwoong ParkUniversity of ChicagoAdresse e-mail validée de uchicago.edu
Suivre

Arend van der Zande
Department of Mechanical Science and Engineering, University of Illinois at Urbana Champaign
Adresse e-mail validée de illinois.edu - Page d'accueil