| A 6 bit vector-sum phase shifter with a decoder based control circuit for X-band phased-arrays B Cetindogan, E Ozeren, B Ustundag, M Kaynak, Y Gurbuz IEEE Microwave and wireless components letters 26 (1), 64-66, 2015 | 85 | 2015 |
| A high dynamic range power detector at X-band E Ozeren, I Kalyoncu, B Ustundag, B Cetindogan, H Kayahan, M Kaynak, ... IEEE Microwave and Wireless Components Letters 26 (9), 708-710, 2016 | 20 | 2016 |
| A D-band SPDT switch utilizing reverse-saturated SiGe HBTs for dicke-radiometers B Cetindogan, B Ustundag, E Turkmen, M Wietstruck, M Kaynak, ... 2018 11th German Microwave Conference (GeMiC), 47-50, 2018 | 17 | 2018 |
| Low-noise amplifiers for W-band and D-band passive imaging systems in SiGe BiCMOS technology B Ustundag, E Turkmen, B Cetindogan, A Guner, M Kaynak, Y Gurbuz 2018 Asia-Pacific Microwave Conference (APMC), 651-653, 2018 | 13 | 2018 |
| 0.13-μm SiGe BiCMOS technology with More-than-Moore modules M Kaynak, M Wietstruck, A Göritz, ST Wipf, M İnaç, B Cetindogan, C Wipf, ... 2017 IEEE Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 62-65, 2017 | 12 | 2017 |
| BiCMOS integrated microfluidic packaging by wafer bonding for lab-on-chip applications M Inac, M Wietstruck, A Göritz, B Cetindogan, C Baristiran-Kaynak, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 786-791, 2017 | 12 | 2017 |
| Design and characterization of a D-band SiGe HBT front-end for dicke radiometers E Turkmen, B Cetindogan, M Yazici, Y Gurbuz IEEE Sensors Journal 20 (9), 4694-4703, 2020 | 9 | 2020 |
| Front-end blocks of a w-band dicke radiometer in sige bicmos technology B Ustundag, E Turkmen, A Burak, B Gungor, H Kandis, B Cetindogan, ... IEEE Transactions on Circuits and Systems II: Express Briefs 67 (11), 2417-2421, 2020 | 7 | 2020 |
| A 5–13 GHz 6-bit vector-sum phase shifter with+ 3.5 dBm IP1dB in 0.25-μm SiGe BiCMOS B Cetindogan, B Ustundag, A Burak, M Wietstruck, M Kaynak, Y Gurbuz 2017 IEEE Asia Pacific Microwave Conference (APMC), 1111-1114, 2017 | 7 | 2017 |
| Oxide surface roughness optimization of BiCMOS beol wafers for 200 mm wafer level microfluidic packaging based on fusion bonding M Inac, M Wietstruck, A Göritz, B Cetindogan, C Baristiran-Kaynak, ... 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC), 1-4, 2017 | 5 | 2017 |
| Design of monocrystalline Si/SiGe multi-quantum well microbolometer detector for infrared imaging systems A Shafique, EC Durmaz, B Cetindogan, M Yazici, M Kaynak, CB Kaynak, ... Infrared Technology and Applications XLII 9819, 473-477, 2016 | 4 | 2016 |
| High Responsivity Power Detectors for W/D-Bands Passive Imaging Systems in 0.13 μm SiGe BiCMOS Technology B Ustundag, E Turkmen, B Cetindogan, M Kaynak, Y Gurbuz 2018 Asia-Pacific Microwave Conference (APMC), 624-626, 2018 | 3 | 2018 |
| The Effect of Surface Optimization on Post-grinding Yield of 200 mm Wafer Level Packaging Applications M Inac, M Wietstruck, A Göritz, B Cetindogan, C Baristiran-Kaynak, ... 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-4, 2018 | 1 | 2018 |
| BiCMOS eingebettete Mikrofluidiktechnologie basierend auf Wafer-Bonding-Techniken für Biosensor-Anwendungen BiCMOS Embedded Microfluidic Technology Based on Wafer Bond-ing … M Inac, M Wietstruck, A Göritz, B Cetindogan, C Baristiran-Kaynak, ... | | 2018 |
| BiCMOS Embedded Microfluidic Technology Based on Wafer Bonding Techniques for Biosensor Applications M Inac, M Wietstruck, A Goeritz, B Cetindogan, C Baristiran-Kaynak, ... MikroSystemTechnik 2017; Congress, 1-4, 2017 | | 2017 |
