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Coauteurs
- John C. MauroDorothy Pate Enright Professor and Associate Head, Materials Science and Engineering, Penn StateAdresse e-mail validée de psu.edu
- Collin WilkinsonAlfred UniversityAdresse e-mail validée de alfred.edu
- Kuo-Hao LeePenn State UniversityAdresse e-mail validée de psu.edu
- Seong H. KimDepartment of Chemical Engineering, Materials Research Institute, Pennsylvania State UniversityAdresse e-mail validée de engr.psu.edu
- Adri van DuinDistinguished Professor of Mechanical Engineering, Penn State UniversityAdresse e-mail validée de psu.edu
- Daniel Roberto CassarProfessor @ Ilum School of Science / CNPEMAdresse e-mail validée de ilum.cnpem.br
- Rebecca S. WelchMaterials Science & Engineering, The Pennsylvania State UniversityAdresse e-mail validée de psu.edu
- Thomas D. BennettMaterials Science and Metallurgy, University of CambridgeAdresse e-mail validée de cam.ac.uk
- Liping HuangRensselaer Polytechnic InsituteAdresse e-mail validée de rpi.edu
- Linfeng DingPenn StateAdresse e-mail validée de psu.edu
- Nicholas SmithCorning IncorporatedAdresse e-mail validée de corning.com
- Caio Barca BragattoAssistant Professor of Physics, Coe CollegeAdresse e-mail validée de coe.edu
- Seung Ho HahnMechatronics Research, Samsung ElectronicsAdresse e-mail validée de samsung.com
- Ismaila DaboAssociate Professor, Corning Faculty Fellow of Materials Science, Pennsylvania State UniversityAdresse e-mail validée de psu.edu
- Arron PotterPostdoctoral scholar, Alfred UniversityAdresse e-mail validée de alfred.edu
- Nathan KeilbartPostdoctoral Research Scientist, Lawrence Livermore National LaboratoryAdresse e-mail validée de llnl.gov
- Anthony DeCeanneDevelopment Scientist, Corning IncAdresse e-mail validée de corning.com