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Avenas Yvan
Avenas Yvan
G2Elab - Université de Grenoble - France
Verified email at grenoble-inp.fr
Title
Cited by
Cited by
Year
Temperature measurement of power semiconductor devices by thermo-sensitive electrical parameters—A review
Y Avenas, L Dupont, Z Khatir
IEEE transactions on power electronics 27 (6), 3081-3092, 2011
6052011
Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermosensitive electrical parameters
L Dupont, Y Avenas, PO Jeannin
IEEE Transactions on Industry Applications 49 (4), 1599-1608, 2013
2782013
Improved reliability of power modules: A review of online junction temperature measurement methods
N Baker, M Liserre, L Dupont, Y Avenas
IEEE Industrial Electronics Magazine 8 (3), 17-27, 2014
2532014
Condition monitoring: A decade of proposed techniques
Y Avenas, L Dupont, N Baker, H Zara, F Barruel
IEEE Industrial Electronics Magazine 9 (4), 22-36, 2015
1252015
Silicon heat pipes used as thermal spreaders
C Gillot, Y Avenas, N Cezac, G Poupon, C Schaeffer, E Fournier
IEEE transactions on components and packaging technologies 26 (2), 332-339, 2003
1042003
New high power—high ratio non isolated DC-DC boost converter for fuel cell applications
DB Viet, Y Lembeye, JP Ferrieux, J Barbaroux, Y Avenas
2006 37th IEEE Power Electronics Specialists Conference, 1-7, 2006
822006
Heat pipe integrated in direct bonded copper (DBC) technology for cooling of power electronics packaging
M Ivanova, Y Avenas, C Schaeffer, JB Dezord, J Schulz-Harder
IEEE Transactions on Power electronics 21 (6), 1541-1547, 2006
812006
Junction temperature measurements via thermo-sensitive electrical parameters and their application to condition monitoring and active thermal control of power converters
N Baker, M Liserre, L Dupont, Y Avenas
IECON 2013-39th Annual Conference of the IEEE Industrial Electronics Society …, 2013
742013
A bus-bar-like power module based on three-dimensional power-chip-on-chip hybrid integration
E Vagnon, PO Jeannin, JC Crebier, Y Avenas
IEEE Transactions on industry applications 46 (5), 2046-2055, 2010
692010
Preliminary evaluation of thermo-sensitive electrical parameters based on the forward voltage for online chip temperature measurements of IGBT devices
L Dupont, Y Avenas
IEEE transactions on industry applications 51 (6), 4688-4698, 2015
642015
An efficient online time-temperature-dependent creep-fatigue rainflow counting algorithm
V Samavatian, H Iman-Eini, Y Avenas
International Journal of fatigue 116, 284-292, 2018
582018
Power MOSFET switching waveforms: an empirical model based on a physical analysis of charge locations
L Aubard, G Verneau, JC Crebier, C Schaeffer, Y Avenas
2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference …, 2002
582002
Effects of creep failure mechanisms on thermomechanical reliability of solder joints in power semiconductors
V Samavatian, H Iman-Eini, Y Avenas, M Samavatian
IEEE Transactions on Power Electronics 35 (9), 8956-8964, 2020
512020
Evaluation of IGBT thermo-sensitive electrical parameters under different dissipation conditions–Comparison with infrared measurements
Y Avenas, L Dupont
Microelectronics Reliability 52 (11), 2617-2626, 2012
482012
Evaluation of thermo-sensitive electrical parameters based on the forward voltage for on-line chip temperature measurements of IGBT devices
L Dupont, Y Avenas
2014 IEEE Energy Conversion Congress and Exposition (ECCE), 4028-4035, 2014
462014
Numerical and experimental investigations of the thermal management of power electronics with liquid metal mini-channel coolers
M Tawk, Y Avenas, A Kedous-Lebouc, M Petit
IEEE Transactions on Industry Applications 49 (3), 1421-1429, 2013
462013
Design of a porous electroosmotic pump used in power electronic cooling
Y Berrouche, Y Avenas, C Schaeffer, HC Chang, P Wang
IEEE transactions on industry applications 45 (6), 2073-2079, 2009
412009
On the use of flat heat pipes as thermal spreaders in power electronics cooling
Y Avenas, C Gillot, A Bricard, C Schaeffer
2002 IEEE 33rd Annual IEEE Power Electronics Specialists Conference …, 2002
402002
Thermal analysis of thermal spreaders used in power electronics cooling
Y Avenas, M Ivanova, N Popova, C Schaeffer, JL Schanen, A Bricard
Conference Record of the 2002 IEEE Industry Applications Conference. 37th …, 2002
382002
Experimental study of a pulsating heat pipe with combined circular and square section channels
M Vassilev, Y Avenas, C Schaeffer, JL Schanen, J Schulz-Harder
2007 IEEE industry applications annual meeting, 1419-1425, 2007
352007
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