| A FCOB packaged thermal wind sensor with compensation GP Shen, M Qin, QA Huang, H Zhang, J Wu Microsystem technologies 16, 511-518, 2010 | 34 | 2010 |
| Monolithic integration of lateral HV power MOSFET with LV CMOS for SiC power IC technology SB Isukapati, H Zhang, T Liu, E Ashik, B Lee, AJ Morgan, W Sung, ... 2021 33rd International Symposium on Power Semiconductor Devices and ICs …, 2021 | 30 | 2021 |
| Direct chip attachment (DCA) packaging of a 2-D thermal flow sensor G Shen, J Wu, H Zhang, M Qin 2007 8th International Conference on Electronic Packaging Technology, 1-3, 2007 | 14 | 2007 |
| Development of Isolated CMOS and HV MOSFET on an N- epi/P- epi/4H-SiC N+ Substrate for Power IC Applications SB Isukapati, AJ Morgan, W Sung, H Zhang, T Liu, A Fayed, AK Agarwal, ... 2021 IEEE 8th Workshop on Wide Bandgap Power Devices and Applications (WiPDA …, 2021 | 12 | 2021 |
| Output control techniques for dual-frequency SIMO buck converters Y Jiang, S Asar, M Ahmed, H Zhang, A Fayed IEEE Transactions on Circuits and Systems I: Regular Papers 66 (10), 4055-4067, 2019 | 12 | 2019 |
| Design of a 2D thermal wind sensor based on MEMS process S Guangping, W Jian, Z Hua, Q Ming, H Qing’an Journal of Semiconductors 28 (11), 1830-1835, 2007 | 8 | 2007 |
| SPICE modeling and CMOS circuit development of a SiC power IC technology T Liu, H Zhang, SB Isukapati, E Ashik, AJ Morgan, B Lee, W Sung, ... 2021 IEEE International Midwest Symposium on Circuits and Systems (MWSCAS …, 2021 | 5 | 2021 |
| Spice modeling and circuit demonstration of a sic power ic technology T Liu, H Zhang, SB Isukapati, E Ashik, AJ Morgan, B Lee, W Sung, ... IEEE Journal of the Electron Devices Society 10, 129-138, 2022 | 4 | 2022 |
| Thermal wind sensor fabricated on low thermal conduction substrate G Shen, M Qin, Q Huang, H Zhang, J Wu Chin. J. Sci. Instrum. 30 (5), 984-989, 2009 | 3 | 2009 |
| Flip-chip on board packaging of a thermal wind sensor GP Shen, M Qin, QA Huang, H Zhang, J Wu 2008 International Conference on Electronic Packaging Technology & High …, 2008 | 3 | 2008 |
| A 600V Half-Bridge Power Stage Fully Integrated with 25V Gate-Drivers in SiC CMOS Technology AF Hua Zhang, Tianshi Liu, Utsav Gupta, Sundar Baby Isukapati, Emran Ashik ... 2022 IEEE 65th International Midwest Symposium on Circuits and Systems …, 2022 | 2 | 2022 |
| A smart 2-D wind sensor with self-test function G Shen, M Qin, QA Huang, Z Dong, H Zhang, J Wu SENSORS, 2008 IEEE, 70-73, 2008 | 2 | 2008 |
| Bias Temperature Instability on SiC n-and p-MOSFETs for High Temperature CMOS Applications EK Ashik, SB Isukapati, H Zhang, T Liu, U Gupta, AJ Morgan, V Misra, ... 2022 IEEE International Reliability Physics Symposium (IRPS), 3B. 4-1-3B. 4-8, 2022 | 1 | 2022 |
| A 400 V Buck Converter integrated with Gate-Drivers and low-voltage Controller in a 25–600 V mixed-mode SiC CMOS technology U Gupta, H Zhang, T Liu, S Isukapati, E Ashik, A Morgan, B Lee, W Sung, ... Analog Integrated Circuits and Signal Processing, 1-12, 2024 | | 2024 |
| Dual-Frequency SIMO Topologies for On-Chip Dynamic Power Supplies AF S. Asar, H. Zhang 2018 IEEE Power Supply on Chip Workshop (PWRSoC), 2018 | | 2018 |
| A System-Level Package of MEMS Thermal Flow Sensor H ZHANG, G SHEN, J WU, M QIN Chinese Journal of Sensors and Actuators, 2008 | | 2008 |
| Design and Test of 2-D MEMS Wind Speed and Direction Sensor G SHEN, J WU, H ZHANG, M QIN, Q HUANG Micronanoelectronic Technology, 2007 | | 2007 |
| Fluid-Solid Coupling Simulation of MEMS Thermal Wind Sensor H ZHANG, G SHEN, J WU, M QIN, Q HUANG Chinese Journal of Electron Devices, 2007 | | 2007 |
Ayman FayedProfessor, Electrical and Computer Engineering, The Ohio State UniversityAdresse e-mail validée de osu.edu
