| A study of tapered 3-D TSVs for power and thermal integrity A Todri, S Kundu, P Girard, A Bosio, L Dilillo, A Virazel IEEE Transactions on Very Large Scale Integration (VLSI) Systems 21 (2), 306-319, 2012 | 77 | 2012 |
| Carbon Nanotubes for Interconnects A Todri-Sanial, J Dijon, A Maffucci Springer, 2017 | 41 | 2017 |
| Multiple cell upset classification in commercial SRAMs G Tsiligiannis, L Dilillo, A Bosio, P Girard, S Pravossoudovitch, A Todri, ... IEEE Transactions on Nuclear Science 61 (4), 1747-1754, 2014 | 40 | 2014 |
| Testing a commercial MRAM under neutron and alpha radiation in dynamic mode G Tsiligiannis, L Dilillo, A Bosio, P Girard, A Todri, A Virazel, SS McClure, ... IEEE Transactions on Nuclear Science 60 (4), 2617-2622, 2013 | 31 | 2013 |
| A survey of carbon nanotube interconnects for energy efficient integrated circuits A Todri-Sanial, R Ramos, H Okuno, J Dijon, A Dhavamani, M Widlicenus, ... IEEE Circuits and Systems Magazine 17 (2), 47-62, 2017 | 23 | 2017 |
| Temperature impact analysis and access reliability enhancement for 1T1MTJ STT-RAM B Wu, Y Cheng, J Yang, A Todri-Sanial, W Zhao IEEE Transactions on Reliability 65 (4), 1755-1768, 2016 | 23 | 2016 |
| Power supply noise aware workload assignment for multi-core systems A Todri, M Marek-Sadowska, J Kozhaya 2008 IEEE/ACM International Conference on Computer-Aided Design, 330-337, 2008 | 23 | 2008 |
| Exploring the impact of functional test programs re-used for power-aware testing A Touati, A Bosio, L Dilillo, P Girard, A Virazel, P Bernardi, MS Reorda 2015 Design, Automation & Test in Europe Conference & Exhibition (DATE …, 2015 | 21 | 2015 |
| Globally constrained locally optimized 3-D power delivery networks A Todri-Sanial, S Kundu, P Girard, A Bosio, L Dilillo, A Virazel IEEE Transactions on very large scale Integration (VLSI) Systems 22 (10 …, 2013 | 19 | 2013 |
| Addressing the thermal issues of STT-MRAM from compact modeling to design techniques L Zhang, Y Cheng, W Kang, L Torres, Y Zhang, A Todri-Sanial, W Zhao IEEE Transactions on Nanotechnology 17 (2), 345-352, 2018 | 18 | 2018 |
| A study of decoupling capacitor effectiveness in power and ground grid networks A Todri, M Marek-Sadowska, F Maire, C Matheron 2009 10th International Symposium on Quality Electronic Design, 653-658, 2009 | 18 | 2009 |
| Energy autonomous wearable sensors for smart healthcare: a review AS Dahiya, J Thireau, J Boudaden, S Lal, U Gulzar, Y Zhang, T Gil, ... Journal of The Electrochemical Society 167 (3), 037516, 2019 | 15 | 2019 |
| Physical Design for 3D Integrated Circuits A Todri-Sanial, CS Tan CRC Press, 2017 | 15 | 2017 |
| Electrothermal analysis of carbon nanotubes power delivery networks for nanoscale integrated circuits A Magnani, M De Magistris, A Todri-Sanial, A Maffucci IEEE Transactions on Nanotechnology 15 (3), 380-388, 2016 | 15 | 2016 |
| Why and how controlling power consumption during test: a survey A Bosio, L Dilillo, P Girard, A Todri, A Virazel 2012 IEEE 21st Asian Test Symposium, 221-226, 2012 | 15 | 2012 |
| A hybrid fault tolerant architecture for robustness improvement of digital circuits DA Tran, A Virazel, A Bosio, L Dilillo, P Girard, S Pravossoudovitch, ... 2011 Asian Test Symposium, 136-141, 2011 | 15 | 2011 |
| Power reduction through X-filling of transition fault test vectors for LOS testing F Wu, L Dilillo, A Bosio, P Girard, S Pravossoudovitch, A Virazel, ... 2011 6th International Conference on Design & Technology of Integrated …, 2011 | 14 | 2011 |
| Power delivery for multicore systems A Todri, M Marek-Sadowska IEEE Transactions on Very Large Scale Integration (VLSI) Systems 19 (12 …, 2011 | 14 | 2011 |
| A complete resistive-open defect analysis for thermally assisted switching MRAMs J Azevedo, A Virazel, A Bosio, L Dilillo, P Girard, A Todri-Sanial, ... IEEE Transactions on Very Large Scale Integration (VLSI) Systems 22 (11 …, 2014 | 13 | 2014 |
| Computing detection probability of delay defects in signal line tsvs C Metzler, A Todri-Sanial, A Bosio, L Dilillo, P Girard, A Virazel, P Vivet, ... 2013 18th IEEE European Test Symposium (ETS), 1-6, 2013 | 13 | 2013 |
