| Next generation microchannel heat exchangers M Ohadi, K Choo, S Dessiatoun, E Cetegen Springer, 2013 | 174 | 2013 |
| Force fed microchannel high heat flux cooling utilizing microgrooved surfaces E Cetegen University of Maryland, College Park, 2010 | 80 | 2010 |
| Prediction of temperature distribution and Nusselt number in rectangular microchannels at wall slip condition for all versions of constant heat flux L Kuddusi, E Cetegen International Journal of Heat and Fluid Flow 28 (4), 2007 | 69 | 2007 |
| Underfill material flow control for reduced die-to-die spacing in semiconductor packages OG Karhade, NA Deshpande, RC Dias, E Cetegen, LD Skoglund US Patent 10,192,810, 2019 | 61 | 2019 |
| Force-fed evaporation and condensation utilizing advanced micro-structured surfaces and micro-channels T Baummer, E Cetegen, M Ohadi, S Dessiatoun Microelectronics Journal 39 (7), 975-980, 2008 | 59 | 2008 |
| Modelling Spontaneous Combustion of Coal. A Arisoy, B Beamish, E Çetegen Turkish Journal of Engineering & Environmental Sciences 30 (3), 2006 | 49 | 2006 |
| Thermal and hydrodynamic analysis of gaseous flow in trapezoidal silicon microchannels L Kuddusi, E Çetegen International Journal of Thermal Sciences 48 (2), 353-362, 2009 | 34 | 2009 |
| Emerging applications of microchannels M Ohadi, K Choo, S Dessiatoun, E Cetegen, M Ohadi, K Choo, ... Next generation microchannel heat exchangers, 67-105, 2013 | 21 | 2013 |
| Methods to form high density through-mold interconnections OG Karhade, NA Deshpande, E Cetegen, EJ Li, D Mallik, BM Ziadeh US Patent 9,741,692, 2017 | 13 | 2017 |
| Thermal interfaces for integrated circuit packages E Cetegen, OG Karhade, K Dhane, CM Jha US Patent 10,290,561, 2019 | 11 | 2019 |
| Thermal management solution for circuit products A Choudhury, JY Chang, DW Song, E Cetegen, A Gupta US Patent 9,477,275, 2016 | 9 | 2016 |
| Open cavity bridge co-planar placement architectures and processes O Karhade, D Raorane, S Agraharam, N Deshpande, M Modi, M Dubey, ... US Patent App. 16/828,405, 2021 | 8 | 2021 |
| High-temperature interfacial adhesion strength measurement in electronic packaging using the double cantilever beam method S Sankarasubramanian, J Cruz, K Yazzie, V Sundar, V Subramanian, ... Journal of Electronic Packaging 139 (2), 020902, 2017 | 8 | 2017 |
| Heat transfer analysis of force fed evaporation on microgrooved surfaces E Cetegen, S Dessiatoun, M Ohadi International Conference on Nanochannels, Microchannels, and Minichannels …, 2008 | 8 | 2008 |
| Force Fed Boiling and Condensation for High Heat Flux Applications E Cetegen, S Dessiatoun, MM Ohadi power 1, 10-3, 2008 | 6 | 2008 |
| Integrated circuit packages with plates OG Karhade, E Cetegen, SB Sane US Patent App. 16/349,959, 2019 | 5 | 2019 |
| Force-Fed Microchannels for High Flux Cooling Applications M Ohadi, K Choo, S Dessiatoun, E Cetegen, M Ohadi, K Choo, ... Next Generation Microchannel Heat Exchangers, 33-65, 2013 | 5 | 2013 |
| Multi objective optimization of a force fed microchannel heat sink E Cetegen, S Dessiatoun, M Ohadi International Conference on Micro/Nanoscale Heat Transfer 43918, 93-100, 2009 | 5 | 2009 |
| Heat Transfer Analysis of Microgrooved Evaporator and Condenser Surfaces Utilized in a High Heat Flux Two-Phase Flow Loop E Cetegen, T Baummer, S Dessiatoun, M Ohadi ASME International Mechanical Engineering Congress and Exposition 43025 …, 2007 | 4 | 2007 |
| Studies on condensation of refrigerants in a high aspect ratio microchannel and in a novel micro-groove surface heat exchanger: development of micro-condensers in compact two … S Dessiatoun, S Chowdhury, E Al-Hajri, E Cetegen, M Ohadi International Conference on Nanochannels, Microchannels, and Minichannels …, 2007 | 4 | 2007 |
