Yaodong Wang
Yaodong Wang
Adresse e-mail validée de apple.com
Citée par
Citée par
Materials, processing and reliability of low temperature bonding in 3D chip stacking
L Zhang, Z Liu, SW Chen, Y Wang, WM Long, Y Guo, S Wang, G Ye, ...
Journal of Alloys and Compounds 750, 980-995, 2018
Size effect on ductile-to-brittle transition in Cu-solder-Cu micro-joints
Y Wang, IM De Rosa, KN Tu
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 632-639, 2015
Interconnect Quality and Reliability of 3D Packaging
Y Wang
Springer International Publishing 57, 375-420, 2017
Porous Cu3Sn Formation in Cu-Sn IMC-Based Micro-Joints
Y Wang
Electronic Components and Technology Conference, 439-446, 2016
Mechanical Reliability Challenges in Cu-Sn Microbump for 3D IC Packaging Technology
Y Wang
University of California, Los Angeles, 2016
Le système ne peut pas réaliser cette opération maintenant. Veuillez réessayer plus tard.
Articles 1–5